NCFP needs to see an SMT style reflow profile to render it fully inactive. This solder paste holds the parts in place until the heat of the oven causes the solder particles to reflow. USA: This material is not considered hazardous by the OSHA hazard Communication. When being used in rework, application should be limited to the area being worked. Appearance, Color and Odor: White paste faint odor. No Clean Flux Gel/Paste is compatible with all tin-lead and lead-free alloys and can be applied by brush or cotton swab, dispense needle, pin transfer, or stencil printing. Residues that remain on surfaces after soldering are clear, leaving a cosmetically appealing repair that can be easily pin probed during in-circuit tests. The superior wetting ability of NCFP results in bright, smooth, and shiny solder joints, whether reflowed by hand, hot-air rework station, convection reflow oven, or vapor phase soldering systems. The 8342 RA Rosin Flux Paste is a superior, electronic grade flux paste that makes surface-mount, electrical, and electronics soldering faster and easier. Soft Soldering/Tinning Flux that is active between 200F and 600F. 100 Lead-Free paste flux cleans and fluxes copper piping to provide uniform solder flow Petroleum base provides. It can be used for the general touch-up or rework of printed circuit boards, as well as for attaching spheres to ball grid array (BGA) packages.

No Clean Flux Gel/Paste (NCFP) is a tacky rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates.

Flux paste